Please plan the target acquisition that takes a full advantage of the FOV in FOCAS.
Note:
Imag: 6 arcmin fai + 5 arcsec gap at
center (between chips)
Spec: Long slit gap at center of each chip
PA=0
PA=90
PA=180 PA=270
____N____
____N____
____N____ ____N____
| chip#2
| | |
| | #1
| | | |
E|_________|W E| #2 | #1 |W
E|_________|W E| #1 | #2 |W
|
| | |
|
|
| | | |
|_chip#1__| |____|____|
|___#2____| |____|____|
S
S
S
S
^red
------> red
| red
<------ |
lambda
|
|
V red
Imag: Spec: In order to avoid the gap between the chips when inserting an object, you need:
It is not necessary to
calculate the coordinates for offset position if the offset is already
given.
Spec: It is not necessary to calculate the coordinates for offset position since the conversion between center slit and offset slit would be done by the option in the pointing abstract command.
The vertical pix is opposite in sign
from
the actual Y coordinate on CCD.
It is for coinciding all the slits at
the
center.
Wavelengths on CCD <-> Empirical value matching the pixel
Slit |
Grism/Order |
Dispersion |
Ang. at 1st pix: CRPIX |
at center pos. |
R300 1st |
-2.68 |
10293 |
|
150 1st |
-5.67 |
12573 |
|
75 1st |
-11.8 |
18563 |
|
R300 2nd |
-1.28 |
5246 |
at offset pos. |
B300 |
-2.79 |
9931 |
All data are taken with 2 bin mode in
wavelength.
Negative dispersion means increasing wavelength as decreasing CCD Y
pixel.
These values are for before the distortion correction.